Division 4.2 Design for dismantling and recycling

1. (a)

   For the following target parts, as relevant to the product, a manual dismantling shall be carried out by one person (i.e. not more than one snap-on connection has to be loosened at the same time) using widely used commercially available tools (i.e. pliers, screw-drivers, cutters and hammers as defined by ISO 5742, ISO 1174, ISO 15601):

   1. (i)

      Printed Wiring Boards > 10 cm²;

   2. (ii)

      Thin Film Transistor (TFT) unit > 100 cm² and film conductors;

   3. (iii)

      Polymethyl Methacrylate (PMMA) board light guide.

2. (b)

   At least one of the following optional components (if applicable) shall also be possible to manually disassemble using common commercially available tools:

   1. (i)

      LED backlight units;

   2. (ii)

      Speaker unit magnets (for display sizes greater than or equal to 25 inches);

   3. (iii)

      HDD drive (if applicable in the case of smart devices).

Assessment and verification: The applicant shall provide:

A test report detailing the dismantling sequence, including a detailed description of the specific dismantling steps, tools and procedures, for the components listed in (a) and the optional component(s) selected from (b).