OpenLegislation

Division 26 Lead in the following applications that are used durably at a temperature below – 20 °C under normal operating and storage conditions:F1

United Kingdom

Original text. Later amendments are not shown.

  1. (a)

    solders on printed circuit boards;

  2. (b)

    termination coatings of electrical and electronic components and coatings of printed circuit boards;

  3. (c)

    solders for connecting wires and cables;

  4. (d)

    solders connecting transducers and sensors.

Lead in solders of electrical connections to temperature measurement sensors in devices which are designed to be used periodically at temperatures below – 150 °C.

These exemptions expire on 30 June 2021 .

Annotations

Textual amendments

F1

Substituted by Commission Delegated Directive (EU) 2016/1028 of 19 April 2016 amending, for the purposes of adapting to technical progress, Annex IV to Directive 2011/65/EU of the European Parliament and of the Council as regards an exemption for lead in solders of electrical connections to temperature measurement sensors in certain devices (Text with EEA relevance).