# Commission Delegated Directive (EU) 2019/172 of 16 November 2018 amending, for the purposes of adapting to scientific and technical progress, Annex III to Directive 2011/65/EU of the European Parliament and of the Council as regards an exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages (Text with EEA relevance), Annex

Extent: E+W+S+N.I.

In Annex III, entry 15 is replaced by the following:
‘
15
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
Applies to categories 8, 9 and 11 and expires on:
21 July 2021 for categories 8 and 9 other than in vitro diagnostic medical devices and industrial monitoring and control instruments;
21 July 2023 for category 8 in vitro diagnostic medical devices;
21 July 2024 for category 9 industrial monitoring and control instruments, and for category 11.
15(a)
Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within integrated circuit flip chip packages where at least one of the following criteria applies:
a semiconductor technology node of 90 nm or larger;
a single die of 300 mm2 or larger in any semiconductor technology node;
stacked die packages with die of 300 mm2 or larger, or silicon interposers of 300 mm2 or larger.
Applies to categories 1 to 7 and 10 and expires on 21 July 2021.
’

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Source: https://www.legislation.gov.uk/eudr/2019/172/annex (the official version)
Page: https://openlegislation.uk/eu-directive-2019-172/annex
Contains public sector information licensed under the Open Government Licence v3.0. Source: legislation.gov.uk, The National Archives.