Annex

United Kingdom

Annex II to Directive 2000/53/EC is amended as follows:

(1)

entry 8(e) is replaced by the following:

‘

8(e). Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead) (²) X

’
(2)

entry 8(f)(b) is replaced by the following:

‘

8(f)(b). Lead in compliant pin connector systems other than the mating area of vehicle harness connectors Vehicles type-approved before 1 January 2024 and spare parts for these vehicles X

’

(3)

entry 8(g) is replaced by the following:

‘

8(g)(i). Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages Vehicles type approved before 1 October 2022 and spare parts for these vehicles X

8(g)(ii). Lead in solders to complete a viable electrical connection between the semiconductor die and the carrier within integrated circuit flip chip packages where that electrical connection consists of any of the following:

(i)

a semiconductor technology node of 90 nm or larger;

(ii)

a single die of 300 mm² or larger in any semiconductor technology node;

(iii)

stacked die packages with dies of 300 mm² or larger, or silicon interposers of 300 mm² or larger.

(²)

Valid for vehicles type-approved from 1 October 2022 and spare parts for these vehicles
X

’

(4)

the following entry 8(k) is inserted:

‘

8(k). Soldering of heating applications with 0,5 A or more of heat current per related solder joint to single panes of laminated glazings not exceeding wall thickness of 2,1 mm. This exemption does not cover soldering to contacts embedded in the intermediate polymer Vehicles type approved before 1 January 2024 and spare parts for these vehicles X(⁴)

’