# Council Regulation (EC) No 428/2009 of 5 May 2009 setting up a Community regime for the control of exports, transfer, brokering and transit of dual-use items (Recast), Division [2B005]: Equipment specially designed for the deposition, processing and in-process control of inorganic overlays, coatings and surface modifications, as follows, for substrates specified in column 2, by processes shown in column 1 in the Table following 2E003.f., and specially designed automated handling, positioning, manipulation and control components therefor:

Extent: E+W+S+N.I.

a..Chemical vapour deposition (CVD) production equipment having all of the following:
NB:
SEE ALSO 2B105.
1..A process modified for one of the following:
a..Pulsating CVD;
b..Controlled nucleation thermal deposition (CNTD); or
c..Plasma enhanced or plasma assisted CVD; and
2..Having any of the following:
a..Incorporating high vacuum (equal to or less than 0,01 Pa) rotating seals; or
b..Incorporating in situ coating thickness control;
b..Ion implantation production equipment having beam currents of 5 mA or more;
c..Electron beam physical vapour deposition (EB-PVD) production equipment incorporating power systems rated for over 80 kW and having any of the following:
1..A liquid pool level "laser" control system which regulates precisely the ingots feed rate; or
2..A computer controlled rate monitor operating on the principle of photo-luminescence of the ionised atoms in the evaporant stream to control the deposition rate of a coating containing two or more elements;
d..Plasma spraying production equipment having any of the following:
1..Operating at reduced pressure controlled atmosphere (equal to or less than 10 kPa measured above and within 300 mm of the gun nozzle exit) in a vacuum chamber capable of evacuation down to 0,01 Pa prior to the spraying process; or
2..Incorporating in situ coating thickness control;
e..Sputter deposition production equipment capable of current densities of 0,1 mA/mm2 or higher at a deposition rate of 15 μm/h or more;
f..Cathodic arc deposition production equipment incorporating a grid of electromagnets for steering control of the arc spot on the cathode;
g..Ion plating production equipment capable of the in situ measurement of any of the following:
1..Coating thickness on the substrate and rate control; or
2..Optical characteristics.
Note:
2B005 does not control chemical vapour deposition, cathodic arc, sputter deposition, ion plating or ion implantation equipment, specially designed for cutting or machining tools.

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Source: https://www.legislation.gov.uk/eur/2009/428/annex/I/division/4/division/2/division/2B005 (the official version)
Page: https://openlegislation.uk/eu-regulation-2009-428/annex-I/division-4/division-2/division-2B005
Contains public sector information licensed under the Open Government Licence v3.0. Source: legislation.gov.uk, The National Archives.