# Council Regulation (EC) No 428/2009 of 5 May 2009 setting up a Community regime for the control of exports, transfer, brokering and transit of dual-use items (Recast), Division [3B503]: Scanning Electron Microscope (SEM) equipment designed for imaging semiconductor devices or integrated circuits, having all of the following:


a.
Stage placement accuracy less (better) than 30 nm;
b.
Stage positioning measurement performed using laser interferometry;
c.
Position calibration within a Field-Of-View (FOV) based on laser interferometer length-scale measurement;
d.
Collection and storage of images having more than 2 x 10 8 pixels;
e.
FOV overlap of less than 5% in vertical and horizontal directions;
f.
Stitching overlap of FOV less than 50 nm; and
g.
Accelerating voltage more than 21 kV;
Note 1.:
3B503 includes SEM equipment designed for chip design recovery.
Note 2.:
3B503 does not control SEM equipment designed to accept a Semiconductor Equipment and Materials International (SEMI) standard wafer carrier, such as a 200 mm or larger Front Opening Unified Pod (FOUP).

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Source: https://www.legislation.gov.uk/eur/2009/428/annex/I/division/5/division/2/division/3B503 (the official version)
Page: https://openlegislation.uk/eu-regulation-2009-428/annex-I/division-5/division-2/division-3B503
Contains public sector information licensed under the Open Government Licence v3.0. Source: legislation.gov.uk, The National Archives.