Chapter GROUP 3D General Industrial Equipment
| IL1301 | Equipment specially designed for the production of nickel-, cobalt-or iron-base alloys in crude or semi-fabricated forms having strengths superior to the AISI 300 series (as at May 1982) at temperatures higher than +922 K (+649°C) under severe environmental conditions … | A |
| except | ||
(1) Electric arc and induction furnaces (other than vacuum induction furnaces used in the production of powders of the aforesaid alloys), basic oxygen furnaces and re-melting equipment using other techniques for the production of carbon steels, low alloy steels and stainless steels; | ||
(2) Degassing equipment used for the production of carbon steels, low alloy steels and stainless steels; | ||
(3) Extrusion presses, hot and cold rolling mills and swaging and forging machines; | ||
(4) Decarburizing, annealing and pickling equipment; | ||
(5) Surface-finishing equipment; and | ||
(6) Slitting and cutting equipment. | ||
| (Note as to electric vacuum furnaces, Group 3C above and as to extrusion presses and hot and cold rolling mills, subsequent entries in this Group.) | ||
| IL1305 | Metal rolling mills, the following– | |
(1) Isothermal rolling mills, except those capable of operating only at ambient temperatures … | A | |
(2) Other mills specially designed or redesigned for the rolling of metals and alloys with a melting point exceeding 1,900°C … | A | |
(3) Specially designed components, accessories and controls for the mills specified in heads (1) and (2) above, and specially designed software therefor … | A | |
| (Note exception (3) in the entry in this Group relating to equipment specially designed for the production of certain nickel-, cobalt-or iron-base alloys.) | ||
| IL1312 | Presses the following– | |
(1) Isostatic presses having either of the following characteristics– | ||
(a) capable of achieving a maximum working pressure of 138 MPa (20,000 p.s.i.) or greater and possessing a chamber cavity with an inside diameter in excess of 406 mm (16 inches); or … | A | |
(b) having a controlled thermal environment within the closed cavity and possessing a working cavity with an inside diameter of 127 mm (5 inches) or more … | A | |
(2) Specially designed dies and moulds (except those used in isostatic presses operating at ambient temperatures), components, accessories and control equipment for the presses specified in head (1)(a) and (b) above, and specially designed software for the use of such presses and their control equipment and components … | A | |
| In this entry isostatic presses are presses capable of pressurising a closed cavity through various media (gas, liquid, solid particles etc) to create equal pressure in all directions within the cavity upon a workpiece or material. | ||
| (Note exception (3) in the entry in this Group relating to equipment specially designed for the production of certain nickel-, cobalt-or iron-base alloys.) | ||
| IL1352 | Nozzles, dies and extruder barrels specially designed for the processing of any of the materials specified in sub-head (2)(b) of the entry in Group 3I relating to fluorocarbon compounds … | A |
| IL1353 | Machinery and apparatus specially designed for the manufacture of cable and optical fibres specified in the entry in Group 3F relating to cable and wire … | A |
| IL1354 | Equipment designed for the manufacture or testing of printed circuit boards, the following– | |
(1) Equipment specially designed for removal of resists or printed circuit board materials by dry (e.g. plasma) methods… | A | |
(2) Computer-aided design (CAD) equipment for printed circuit boards, having any of the following functions– | ||
(a) generation of artwork design with an interactive capability… | A | |
(b) generation of test string lists for multi-layer boards… | A | |
(c) generation of data or programmes for stored-programme controlled printed circuit board drilling equipment… | A | |
(d) generation of data or programmes for stored-programme controlled printed circuit board shaping and profiling equipment… | A | |
(e) generation of data for control of the sequencing of processess of the equipment for printed circuit board manufacture covered by head (3) of this entry… | A | |
(3) High-speed automated continuous panel processors for plating capable of delivering 860 A/mu22 (80A/ftu22) or more of plate current… | A | |
| except processors specially designed for plating tab (edge) connectors. | ||
(4) Stored-programme controlled inspection equipment for the detection of defects in printed circuit boards using optical pattern comparison or other machine scanning techniques… | A | |
(5) Stored-programme controlled electrical test equipment for the identification of open and short circuits on bare printed circuit boards, capable of– | ||
(a) continuity testing (4 ohm or less) at a rate of 2,500 or more measurements per second… | A | |
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(b) high voltage testing (50 volts or more) at a rate of 10,000 or more measurements per minute… | A | |
(6) Stored-programme controlled multispindle drills and routers having any of the following characteristics– | ||
(a) absolute positioning accuracy of .26610 micrometers (0.0004 inch) or better… | A | |
(b) minimum time needed for drill bit changes of 5 seconds or less… | A | |
(c) X and Y positioning speeds of 0.125 metres per second (300 inches per minute) or higher for drilling or for routing… | A | |
(7) Stored-programme controlled cyclic voltametric stripping equipment specially designed for printed circuit board plating bath monitoring and analysis… | A | |
(8) Specially designed components and accessories and specially designed software for the equipment specified in heads (1) to (7) above (inclusive)… | A | |
| except equipment with controls using any of the following– | ||
(a) cams and other purely mechanical means; | ||
(b) switches, including thumbwheel switches; | ||
(c) plugboards; | ||
(d) on-off and analogue controllers; | ||
(e) diode matrices; or | ||
(f) punched paper tape controllers without a capability to compute, manipulate, or store and re-run programme data. | ||
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| (Note head (2) of the entry in Group 3F relating to lasers and laser systems.) | ||
| IL1355 | Equipment for the manufacture or testing of electronic components and materials, the following– | |
(1) Equipment specially designed for the manufacture or testing of electron tubes specified in the entries in Group 3F relating to electronic cathode-ray tubes, cold cathode tubes, triggered spark gaps, thyratrons, electron tubes or valves, and of optical elements specified in the entry in Group 3F relating thereto… | A | |
(2) Equipment specially designed for the manufacture or testing of semiconductor devices, integrated circuits and assemblies, and systems incorporating or having the characteristics of such equipment, the following– | ||
(a) equipment for producing polycrystalline silicon specified in the entry in Group 3I relating to compounds and materials, having a purity of 99.99% or greater in the form of rods (ingots, boules), pellets, sheets, tubes or small particles… | A | |
(b) equipment specially designed for purifying or processing III-V or II-VI semiconductor materials specified in the entry in Group 3I relating to compounds and materials… | A | |
(c) crystal pullers, furnaces and gas systems, the following– | ||
(i) types with specially designed stored-programme-controlled temperature, power input or gas, liquid or vapour flow… | A | |
(ii) diffusion, oxidation and annealing furnaces for operation at pressures above 1 atmosphere (nominal)… | A | |
(iii) annealing or re-crystallizing equipment other than constant temperature furnaces employing high rates of energy transfer capable of processing wafers at a rate greater than 50 square centimetres per minute… | A | |
(iv) plasma-enhanced or photo-enhanced chemical reactor equipment… | A | |
(v) equipment for automatic control of crystal taper and diameter… | A | |
| ||
(a) radiation pyrometers; | ||
(b) thermocouples; | ||
(c) RF power sensors; or | ||
(d) mass weighing, without digital or anomaly control permitting the growth of semi-conductors. (vi) crystal pullers having any of the following characteristics–… | A | |
(a) rechargeable without replacing the crucible containers; | ||
(b) capable of operation at pressures above or below 10u25 pascals (1 atomosphere absolute); | ||
(c) capable of pulling crystals of a diameter greater than 76.2 mm; | ||
(d) specially designed to minimise convection currents in the melt by the use of magnetic fields or multiple crucibles; or | ||
(e) capable of pulling sheet or ribbon crystals. | ||
(vii) vacuum induction-heated zone-refining equipment for operation at a pressure of 0.01 pascal or less… | A | |
(d) equipment for epitaxial growth having any of the following characteristics– | A | |
(i) operation at pressures below 10u25 pascals (1 atmosphere absolute); | ||
(ii) stored-programme-controlled; | ||
(iii) rotating vertical-support radiant-heated reactors; | ||
(iv) specially designed for processing bubble memories; | ||
(v) metal-organic chemical vapour deposition reactors; or | ||
(vi) for liquid phase epitaxy. | ||
(e) molecular beam epitaxial growth equipment… | A | |
(f) magnetically enhanced sputtering equipment… | A | |
(g) equipment designed for ion implantation or ion-enhanced or photo-enhanced diffusion… | A | |
(h) equipment for selective or non-selective removal by dry methods of passivation layers, dielectrics, semiconductor materials, resists or metals… | A | |
| except horizontal, cylindrical, plasma etchers without stored-programme-control end-point detection, automatic loading or rotating mechanisms and not having the capability for parallel plate etching as used in semiconductor device manufacture or vacuum sputtering equipment designed to operate in the sputter-etch mode | ||
(i) equipment for semiconductor device fabrication operating below 10u25 pascals (1 atmosphere absolute) for the chemical vapour deposition of oxides, nitrides, metals, and polysilicon, except reactive-sputtering equipment… | A | |
(j) electron beam systems (including scanning electron microscopes) capable of mask making or semiconductor device processing and having any of the following characteristics–… | A | |
(i) electrostatic beam deflection; | ||
(ii) shaped, non-Gaussian beam profile; | ||
(iii) beam blanking capability; | ||
(iv) digital-to-analogue conversion accuracy greater than 12 bit; | ||
(v) digital-to-analogue conversion rate greater than 3 MHz; or | ||
(vi) target-to-beam position feed-back control precision of 1 micrometre or finer; | ||
| except | ||
(a) electron beam deposition systems; and | ||
(b) scanning electron microscopes having beam blanking capability which are equipped for Auger analysis. | ||
(k) surface-finishing equipment, specially designed for the processing of semiconductor wafers and having any of the following characteristics–… | A | |
(i) waxless or non-adhesive mounting; | ||
(ii) double-sided simultaneous polishing or lapping; | ||
(iii) capable of polishing and lapping wafers greater than 76.2 mm in diameter; or | ||
(iv) lapping or polishing in two stages on the same machine. | ||
(l) interconnection equipment which may include common single or multiple vacuum chambers specially designed to permit the integration of equipment specified in this entry into a complete system… | A | |
(3) Masks, mask substrates, Mask-making equipment and image transfer equipment for the manufacture of the devices and components specified in head (2) above, the following– | ||
(a) finished masks, reticles and designs therefor… | A | |
(b) hard surface (e.g. chromium, silicon, iron oxide) coated substrates (e.g. glass, quartz, sapphire) for the preparation of masks having dimensions greater than 76.2 mm by 76.2 mm… | A | |
(c) computer-aided design (CAD) equipment for transforming schematic or logic diagrams into designs for producing semiconductor devices or intergrated circuits, having any of the following functions–… | A | |
(i) storage of pattern cells for sub-division of integrated circuits; | ||
(ii) scaling, positioning or rotation of pattern cells; | ||
(iii) interactive graphic capabilities; | ||
(iv) design rule and circuit checking; or | ||
(v) circuit layout modification of the arrangement of the elements | ||
(d) mask fabrication machines using photo-optical methods, the following– | ||
(i) step and repeat cameras capable of producing arrays larger than 63.5 mm by 63.5 mm, or capable of producing a single exposure larger than 3.75 mm by 3.75 mm in the focal plane, or capable of producing useful line widths of 3.5 micrometres or less… | A | |
(ii) pattern generators specially designed for the generation or manufacture of masks or the creation of patterns in photosensitive layers and with placement precision finer than 10 micrometres… | A | |
(iii) mask fabrication equipment containing automatic adjustment of focus or adjustment of the mask material into the focal plane… | A | |
(iv) equipment and holders for altering masks or reticles to remove defects… | A | |
(e) mask, reticle or pellicle inspection equipment, the following– | ||
(i) for comparison with a precision of 0.75 micrometre or finer over an area of 63.5 mm by 63.5 mm or greater… | A | |
(ii) stored-programme-controlled equipment with a resolution of 0.25 micrometre or finer and with a precision of 0.75 micrometre or finer over a distance in one or two co-ordinates of 63.5 mm or greater… | A | |
(iii) stored-programme-controlled defect inspection equipment, except conventional scanning electron microscopes not specially designed or instrumented for automatic pattern inspection… | A | |
(f) align and expose equipment using photo-optical methods, including projection image transfer equipment, capable of performing any of the following functions–… | A | |
(i) Production of a useful pattern size of less than 5 micrometres; | ||
(ii) alignment with a precision finer than 1 micrometre; | ||
(iii) field coverage greater than 76.2 mm by 76.2 mm; | ||
(iv) wafer backside alignment; | ||
(v) automatic alignment by the sensing of patterns or index marks on the substrate; or | ||
(vi) projection image transfer for the processing of slices (wafers) of 50.8 mm or greater in diameter (in the case of equipment except non contacting (proximity) image transfer equipment). | ||
(g) electron beam, ion beam, or X-ray equipment for projection image transfer… | A | |
(h) photo-optical or non-photo-optical step and repeat or partial field equipment for the transfer of the image on to the wafer… | A | |
(i) mask contact image transfer equipment for imaging a field greater than 76.2 mm by 76.2 mm… | A | |
(4) Stored-programme-controlled inspection equipment for the detection of defects in processed wafers, substrates or chips using optical pattern comparison or other machine scanning techniques, except conventional scanning electron microscopes not specially designed or instrumented for automatic pattern inspection… | A | |
(5) Specially designed stored-programme-controlled measuring and analysis equipment, the following– | ||
(a) specially designed for the measurement of oxygen or carbon content in semi-conductor materials… | A | |
(b) equipment for concurrent etching and doping profile analysis (employing capacitance-voltage or current-voltage analysis techniques)… | A | |
(c) equipment for line-width measurement with a resolution of 1.0 micrometre or finer… | A | |
(d) specially designed flatness measurement instruments capable of measuring deviations from flatness of 10 micrometres or less with a resolution of 1.0 micrometre or finer… | A | |
(6) Equipment for the assembly of integrated circuits specified in head (2) above, the following– | ||
(a) stored-programme-controlled die (chip) mounters and bonders with a positioning accuracy finer than 50 micrometres or incremental steps finer than 6.4 micrometres… | A | |
(b) stored-programme-controlled wire bonders and welders for performing consecutive bondror performing consecutive bonding operations… | A | |
(c) equipment for producing multiple bonds in a single operation, including but not limited to beam lead bonders, chip carrier bonders and tape bonders… | A | |
(d) semi-automatic or automatic hot cap sealers, in which the cap is heated locally to a higher temperature than the body of the package, specially designed for ceramic microcircuit packages specified in the entry in Group 3F relating to electronic component assemblies and which have a throughput equal to or greater than one package per minute or thermal compression bonders (also known as nail head bonders)… | A | |
| except, general purpose resistance type spot welders | ||
(7) Stored-programme-controlled wafer probing equipment having any of the following characteristics–… | A | |
(a) positioning accuracy finer than 50 micrometres, or incremental steps finer than 6.4 micrometres; | ||
(b) individual die location read-out (X–Y position information) during testing; | ||
(c) capability of testing devices having more than a total of 24 terminals; or | ||
(d) automatic slice (wafer) alignment. | ||
(8) Test equipment, except test equipment which is not of a general purpose nature and which is specially designed for, and dedicated to, testing assemblies or a class of assemblies for home and entertainment applications or testing electronic components, assemblies, sub-assemblies and microcircuits not specified in the entry in Group 3F relating to electronic component asemblies provided they do not incorporate computing facilities with user-accessible programming capabilities, the following– | ||
(a) stored-programme-controlled equipment specially designed for testing discrete semiconductor devices and unencapsulated dice, capable of performing any of the following functions–… | A | |
(i) measurement of time intervals of less than 10 nanoseconds; | ||
(ii) measurement of parameters (such as fd2T, S parameters, noise figure) at frequencies greater than 250 MHz; | ||
(iii) resolution of currents of less than 100 picoamperes; | ||
(iv) measurement of spectral response at wavelengths outside the range from 450 to 950 nanometres. | ||
(b) stored-programme-controlled equipment specially designed for testing integrated circuits and assemblies thereof, capable of performing any of the following functions–… | A | |
(i) functional (truth table) testing at a pattern rate greater than 2 MHz; | ||
(ii) resolution of currents of less than 1 nanoampere; | ||
(iii) testing of integrated circuits (not mounted on circuit boards) in packages having more than a total of 24 terminals, except equipment specially designed for and dedicated to the testing of integrated circuits other than those specified in the entry in Group 3F relating to electronic components; or | ||
(iv) measurements of rise times, fall times and edge placement times with a resolution of less than 20 nanoseconds. | ||
(c) equipment specially designed for determining the performance of focal-plane arrays at wavelengths greater than 1,200 nanometres, using stored-programme-controlled measurements or computer-aided evaluation and having any of the following characteristics–… | A | |
(i) using scanning light spot diameters of less than 0.12 mm; | ||
(ii) designed for measuring photosensitive performance parameters and for evaluating frequency response, modulation transfer function, uniformity of responsitivity or noise; | ||
(iii) designed for eavaluating arrays capable of creating images of greater than 32 × 32 line elements. | ||
(d) specially designed for bubble memories… | A | |
(9) Class 10 filters capable of providing an environment of 10 or fewer particles of 0.3 micrometre or more per cubic foot and filter materials therefor… | A | |
(10) Pellicles made of polycrystalline silicon as defined in the entry on Group 3I relating thereto… | A | |
(11) Specially designed components, accessories and software for the equipment specified in heads (1) to (10) above (inclusive) except quartz crucibles specially designed for equipment specified in head (2) above… | A | |
(12) Software for the design of semiconductor devices or microcircuits which– | ||
(a) performs any of the functions in sub-head 3(c) above… | A | |
(b) can be used for transient analysis… | A | |
(c) can be used for logic analysis or logic checking… | A | |
(d) can be used for automatic routing or cell placement… | A | |
(e) can be used for the generation of test vectors… | A | |
(f) can be used for process simulation… | A | |
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| IL1356 | Equipment specially designed or incorporating modifications for the continuous coating of polyester base magnetic tape used as a recording medium specified in sub-head (4) of the entry in Group 3G relating to recording and reproducing equipment, and specially designed components therefor … | A |
| except general purpose continuous coating equipment. | ||
| IL1357 | Equipment for the production of fibres specified in the entries in Group 3I relating to fibrous and filamentary materials or their composites, the following– | |
(1) Filament winding machines of which the motions for positioning, wrapping and winding fibres are co-ordinated and programmed in three or more axes, specially designed to fabricate composite structures or laminates from fibrous and filamentary materials; and co-ordinating and programming controls therefor … | A | |
(2) Tape-laying machines of which the motions for positioning and laying tape and sheets are co-ordinated and programmed in two or more axes, specially designed for the manufacture of composite airframes and missile structures … | A | |
(3) Interlacing machines, including adapters and modification kits, for weaving, interlacing or braiding fibres or fabricate composite structures, except textile machinery which has not been modified for the above end-uses … | A | |
(4) Specially designed or adapted equipment for the production of fibrous and filamentary materials specified in heads (1) and (2) of the entry in Group 3I relating to fibrous and filamentary materials, the following– | ||
(a) equipment for converting polymeric fibres (such as polyacrylonitrile, rayon, or polycarbosilane) including special provision to strain the fibre during heating … | A | |
(b) equipment for the vapour deposition of elements or compounds on heated filamentary substrates … | A | |
(c) equipment for the wet-spinning of refractory ceramics (such as aluminium oxide) … | A | |
(5) Specially designed or adapted equipment for special fibre surface treatment or for producing prepregs and preforms specified in head (3) of the entry in Group 3I relating to fibrous and filamentary materials … | A | |
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(6) Specially designed components and accessories and specially designed software, for equipment specified in heads (1) to (5) above (inclusive) … | A | |
| Specially designed or adapted components and accessories for the machines covered by this entry include, but are not limited to, moulds, mandrels, dies, fixtures and tooling for the preform pressing, curing, casting, sintering or bonding of composite structures, laminates and manufactures thereof covered by the entry therefor in Group 3I. | ||
| IL1358 | Equipment specially designed for the manufacture or testing of devices and assemblies included in heads (2) to (5) (inclusive) of the entry in Group 3G relating to materials composed of crystals having spinel, hexagonal, orthorhombic or garnet crystal structures, and thin film devices and for the manufacture or testing of magnetic recording media, other than tape, specified in head (4) of the entry in Group 3G relating to recording or reproducing equipment, the following– | |
(1) Equipment for the manufacture of single and multi-aperture forms specified in heads (2) to (4) (inclusive) of the entry in Group 3G relating to materials composed of crystals, and single aperture forms of ferrites having a maximum dimension less than 0.76 mm, the following– | ||
(a) automatic presses for the production of the specified forms … | A | |
(b) press dies for the production of the specified forms … | A | |
(c) automatic equipment for the monitoring, grading, sorting, exercising or testing of the specified forms … | A | |
(2) Equipment for the manufacture of thin film devices and associated equipment, the following– | ||
(a) equipment for the manufacture of thin film memory storage or switching devices having square hysteresis loops … | A | |
(b) automatic equipment for the monitoring, grading, sorting, exercising or testing of thin film (including plated wire and plated rods) memory storage or switching devices … | A | |
(3) Automatic equipment for monitoring, exercising or testing assemblies of any devices specified in heads (2) to (4) (inclusive) of the entry in Group 3G relating to materials composed of crystals … | A | |
(4) Equipment which incorporates specially designed modifications for the application of magnetic coating to flexible disk recording media with a packing density exceeding 2460 bit per cm (6250 bit per inch) … | A | |
| except general purpose coating equipment. | ||
(5) Equipment specially designed for the application of magnetic coating to non-flexible (rigid) disk type recording media specified in head (4) of the entry in Group 3G relating to recording or reproducing equipment … | A | |
(6) Stored-programme-controlled equipment for monitoring, grading, exercising or testing recording media other than tape specified in head (4) of the entry in Group 3G relating to recording or reproducing equipment … | A | |
(7) Specially designed components and software for the equipment specified in heads (1) to (5) (inclusive) … | A | |
| IL1359 | Specially designed tooling and fixtures for the manufacture of fibre-optic connectors and couplers specified in head 2(f) of the entry in Group 3F relating to cable and wire … | A |
| IL1360 | Stored-programme-controlled equipment capable of automatic X-ray orientation and angle correction of double-rotated stress-compensated quartz crystals and specified in the entry in Group 3G relating to quartz crystals having piezo-electric qualities, with a tolerance of 10 seconds of arc maintained simultaneously in both angles of rotation … | A |
| IL1361 | Test facilities and equipment for the design or development of aircraft or gas turbine aero-engines, the following– | |
(1) Supersonic (Mach 1.4 to Mach 5), hypersonic (Mach 5 to Mach 15) and hypervelocity (above Mach 15) wind tunnels, except those specially designed for educational purposes and having a test section size (measured internally) of less than 25 cm … | A | |
(2) Devices for simulating flow-environments of Mach 5 and above, including but not limited to hot shot tunnels, plasma arc tunnels, shock tubes, shock tunnels, gas tunnels and light gas guns … | A | |
(3) Wind tunnels and devices, other than two-dimensional sections, having unique capabilities for simulating Reynolds number flow in excess of 25 × 10u26 at transonic velocities … | A | |
(4) Automated control systems, instrumentation (including sensors) and automated data-acquisition equipment, specially designed for use with wind tunnels and devices specified in heads (1) to (3) above (inclusive) … | A | |
(5) Models, specially designed for use with wind tunnels, of aircraft, helicopters, airfoils, spacecraft, space launch vehicles or rockets specified in the entries in Groups 1 and 3E relating thereto or of surface-effect vehicles specified in head (2) of the entry in Group 3E relating to ships … | A | |
(6) Specially designed electromagnetic interference and electromagnetic pulse simulators … | A | |
(7) Specially designed test facilities and equipment for the development of gas turbine aero-engines and components, the following– | ||
(a) special test facilities capable of applying dynamic flight loads, measuring performance or simulating the design operating environments for rotating assemblies or aero-engines … | A | |
(b) test facilities, test rigs and simulators for measuring combustion system and hot gas flow path performance, heat transfer and durability for static assemblies and aero-engine components … | A | |
(c) specially designed test rigs, equipment or modified gas turbine engines which are used for development of gas turbine aero-engine internal flow systems (gas path seals, air-oil seals and disc cavity flow fields) … | A | |
(8) Specially designed components, accessories and software for the facilities and equipment specified in heads (1) to (7) above (inclusive) … | A | |
| IL1362 | Vibration test equipment and ancillary equipment therefor, the following– | |
(1) Vibration test equipment using digital-control techniques and specially designed ancillary equipment and software therefor … | A | |
| except | ||
(a) mechanical and pneumatic exciters (thrusters); | ||
(b) other individual exciters (thrusters) with a maximum thrust of less than 100 kN; | ||
(c) vibrometers; | ||
(d) analogue equipment; and | ||
(e) other ancillary equipment unless falling within a description in an entry in Groups 3F or 3G. | ||
(2) High intensity acoustic test equipment having either of the following characteristics– | ||
(a) capable of producing an overall sound pressure level of 140 dB or greater (referenced to 2 × 10u2–u25 Nmu22 … | A | |
| or | ||
(b) having a rated output of 4 kW or greater … | A | |
| A | |
| except | ||
(i) analogue equipment; and | ||
(ii) other ancillary equipment unless falling within a description in an entry in Groups 3F or 3G. | ||
(3) Ground vibration (including modal survey) test equipment which uses digital-control techniques, and specially designed ancillary equipment and software therefor … | A | |
| except | ||
(a) analogue equipment; and | ||
(b) other ancillary equipment unless falling within a description in an entry in Groups 3F or 3G. | ||
| IL1363 | Specially designed water tunnel equipment, components, accessories and data bases for the design and development of vessels, the following– | |
(1) Automated control systems, instrumentation (including sensors) and data acquisition equipment specially designed for water tunnels … | A | |
(2) Automated equipment to control air pressure acting on the surface of the water in the test section during the operation of the water tunnel … | A | |
(3) Components and accessories for water tunnels, the following– | ||
(a) balance and support systems … | A | |
(b) automated flow or noise measuring devices … | A | |
(c) models of hydrofoil vessels, surface-effect vehicles and specially designed equipment and components specified in heads (1), (2), (4) of the entry in Group 3E relating to ships, for use in water tunnels … | A | |
(4) Data bases generated by use of equipment specified in heads (1) to (3) above (inclusive) … | A | |
(5) Specially designed software for the equipment, components, accessories and data bases specified in this entry … | A | |
| IL1364 | Machinery and equipment for the manufacture of hydrofoil vessel and surface-effect vehicle structures and components, the following– | |
(1) Specially designed equipment for manufacturing anisotropic, orthotropic or sandwich structures specified in sub-head (12)(c) of the entry in Group 3E relating to ships … | A | |
(2) Specially designed equipment for the production and testing of flexible materials for skirts, seals, air curtains, bags and fingers for surface-effect vehicles … | A | |
(3) Specially designed equipment for the production of water-screw propellers specified in head (13) of the entry in Group 3E relating to ships … | A | |
(4) Specially designed equipment for the production, dynamic balancing and automated testing and inspection of lift fans for surface-effect vehicles … | A | |
(5) Specially designed equipment for the production of water-jet propulsion pumps rated at 3,000 hp or more, or multi-pump system equivalents thereof … | A | |
(6) Specially designed equipment for the production, dynamic balancing and automatic testing of sectored disc and concentric-drum rotors for DC homopolar machines … | A | |
(7) Specially designed components and accessories for the equipment specified in heads (1) to (6) above (inclusive) … | A | |
| IL1365 | Equipment specially designed for in-service monitoring of acoustic emissions in airborne vehicles, or in under-water vehicles specified in the entry in Group 3E relating to deep submergence vehicles, capable of discriminating acoustic emissions related to crack growth from innocuous noise sources and capable of spatial location of the crack, and specially designed components, accessories and software therefor … | A |
| IL1370 | Machine tools for generating optical quality surfaces and specially designed components, accessories and software therefor, the following– | |
(1) Turning machines using a single point cutting tool and having all of the following characteristics … | A | |
(a) slide positioning accuracy finer than 0.0005 mm per 300 mm of travel, TIR (peak-to-peak); | ||
(b) slide positioning repeatability finer than 0.00025 mm per 300 mm of travel, TIR (peak-to-peak); | ||
(c) spindle runout (radial and axial) less than 0.0004 mm TIR (peak-to-peak); | ||
(d) angular deviation of the slide movement (yaw, pitch and roll) less than 2 seconds of arc (peak-to-peak) over full travel; and | ||
(e) slide perpendicularity less than 0.001 mm per 300 mm of travel, TIR (peak-to-peak). | ||
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(2) Fly cutting machines having both of the following characteristics … | A | |
(a) spindle run-out (radial and axial) less than 0.0004 mm TIR (peak-to-peak); | ||
(b) angular deviation of slide movement (yaw, pitch and roll) less than 2 seconds of arc (peak-to-peak) over full travel. | ||
(3) Specially designed components, the following– | ||
(a) spindle assemblies, consisting of spindles and bearings as a minimum assembly, except those assemblies with axial and radial axis motion measured along the spindle axis in one revolution of the spindle equal to or greater than 0.0008 mm TIR (peak-to-peak) … | A | |
(b) linear induction motors used as drives for slides having all of the following characteristics– … | A | |
(i) stroke greater than 200 mm; | ||
(ii) nominal force rating greater than 45 N; and | ||
(iii) minimum controlled incremental movement less than 0.001 mm. | ||
(4) Specially designed accessories, the following– | ||
| A | |
(a) flawless and chip-free cutting edge when magnified 400 times in any direction; | ||
(b) cutting radius between 0.1 mm and 5 mm; and | ||
(c) cutting radius out-of-roundness less than 0.002 mm TIR (peak-to-peak). | ||
| IL1371 | Anti-friction bearings and components therefor, the following– | |
(1) Ball and roller bearings having an inner bore diameter of 10 mm or less and having tolerances specified in Table 2 (EP5) of British Standard 292: 1969, or better and either of the following characteristics– | ||
(a) made of any material… | A | |
| except | ||
(i) low carbon steel containing not more than 0.4% of carbon and no other elements other than those present as impurities or in such low quantities as not to modify the basic characteristics of the steel; | ||
(ii) high carbon chromium steel types Steel-534A99 and 535A99 as specified in British Standard 970: Part 2: 1970, or equivalent types normally used in the manufacture of ball or roller bearings; | ||
(iii) nickel-molybdenum steel type Steel-665M17 as specified in British Standard 970: Part 3: 1971, or equivalent types normally used in the manufacture of ball or roller bearings; and | ||
(iv) stainless steel type AISI-440C (SAE-51440C) or equivalent types normally used in the manufacutre of ball or roller bearings; or | ||
(b) processed by heat treatment for the purpose of stabilising such bearings for use at normal temperatures over 150°C… | A | |
(2) Ball and roller bearings (except separable ball bearings and thrust ball bearings) having an inner bore diameter exceeding 10 mm and having tolerances specified in Table 3 (EP7) of British Standard 292: 1969, or better, and either of the characteristics in sub-heads (1)(a) or (1)(b) of this entry… | A | |
(3) Ball and roller bearings having tolerances better than those specified in Table 3 (EP7) of British Standard 292: 1969… | A | |
(4) Gas-lubricated foil bearings… | A | |
(5) Components of ball and roller bearings, usable only for bearings specified in heads (1) to (3) above (inclusive), the following: | ||
| outer rings, inner rings, retainers, balls, rollers and sub-assemblies… | A | |
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| IL1385 | Specially designed production equipment for compasses, gyroscopes (gyros), acclerometers and inertial equipment specified in the entry in Group 3E relating to compasses, gyroscopes (gyros), accelerometers and inertial equipment… | A |
| IL1391 | Robots, robot controllers and robot end-effectors, the following– | |
(1) Robots having any of the following characteristics: | ||
(a) capable of employing feedback information on-line (real-time) from one or more sensors to generate programmes or modify programmed instructions on numerical programme data… | A | |
| except those using information derived only from sensors used to measure– | ||
(i) the velocity, position (other than inertial position measuring systems), drive motor current, voltage, fluid or gas pressure or temperature of the robot; | ||
(ii) through-the-arc current (or voltage) for weld seam tracking; or | ||
(iii) binary or scalar values for– | ||
(a) position, via photo-electric, inductive or capacitive proximity sensors; | ||
(b) tool drive motor voltage or current or hydraulic/pneumatic pressure for determination of force or torque; and | ||
(c) external safety functions. | ||
(b) specially designed to comply with national safety standards applicable to explosive munitions environments… | A | |
(c) incorporating means of protecting hydraulic lines against externally induced punctures caused by ballistic fragments and designed to use hydraulic fluids with flash points higher than 839 K (566°C)… | A | |
(d) specially designed for under water use… | A | |
(e) operable at altitudes exceeding 30,000 metres… | A | |
(f) specially designed for outdoor applications and meeting military specifications therefor… | A | |
(g) specially designed or rated for operating in an electromagnetic pulse (EMP) environment… | A | |
(h) specially designed or rated as radiation-hardened beyond that necessary to withstand normal industrial (other than nuclear industry) ionising radiation… | A | |
(i) equipped with robot manipulator arms which contain titanium-based alloys specified in the entry in Group 3H relating thereto or fibrous and filamentary materials specified in the entry in Group 3I relating thereto… | A | |
(j) equipped with precision measuring devices specified in the entry in Group 3F relating to precision linear and angular measuring systems… | A | |
(k) specially designed to move autonomously its entire structure through three-dimensional space in a simultaneously coordinated manner except systems in which the robot moves on a fixed track… | A | |
(2) Electronic controllers having any of the following characteristics: | ||
(a) controllers specially designed to be part of a robot specified in sub-heads (b) to (h) inclusive, (j) or (k) of head (l) above… | A | |
(b) minimum programmable increment less (finer) than 0.001 mm per linear axis… | A | |
(c) having more than one integral interface which meets or exceeds ANSI/IEEE standard 488-1978, IEC publication 625-1 or any equivalent standard for parallel data exchange… | A | |
(d) capable of being programmed by means other than lead-through, key-in or teach-pendant techniques… | A | |
(e) word size exceeds 16 bit (excluding parity bits)… | A | |
(f) incorporating interpolation algorithms for an order of interpolation higher than linear or circular… | A | |
(g) permitting on-line (real-time) generation or modification of the programmed path, velocity and functions other than the following–… | A | |
(i) manual velocity override; | ||
(ii) fixed linear or rotary axis offset; | ||
(iii) manual robot path editing (including manual path compensation) excluding source language used to programme automatically the robot path, velocity or function; | ||
(iv) branching to pre-programmed modification of the robot path, velocity or function; | ||
(v) fixed cycles; | ||
(vi) key-in or teach-in modifications. | ||
(3) End-effectors having any of the following characteristics: | ||
(a) equipped with one or more sensors, except sensors used to measure the parameters or values specified in sub-heads (a)(i), (ii) or (iii) of head (1) above;… | A | |
(b) having integrated computer-aided data processing… | A | |
| ||
(c) equipped with an integral interface which meets or exceeds ANSI/IEEE Standard 488-1978, IEC publication 625-1 or any equivalent standard for parallel data exchange… | A | |
(d) having any of the characteristics specified in sub-heads (b) to (h) inclusive or (j) of head (l) above… | A | |
(4) Specially designed components and specially designed software for the equipment specified in heads (1) to (3) above (inclusive) … | A | |
| In this entry– | ||
| “robot” means a manipulation mechanism which is reprogrammable, multifunctional and capable of positioning or orientating material, parts, tools or special devices through variable movements in three-dimensional space. It incorporates two or more closed or open loop servo-devices (including stepping motors) and is reprogrammed by means of the teach/playback method, an electronic computer or a programmable logic controller; | ||
| “end-effectors” include grippers, active tool units (being devices for applying motive power, process energy or sensing to the workpiece) and any other tooling that is attached to the baseplate on the end of the robot’s manipulator arms; and | ||
| “sensor” means a detector of a physical phenomenon, the output of which (after conversion into a signal that can be interpreted by a controller) is able to generate programmes or modified programmed instructions or numerical programme data, and includes sensors with machine vision, infrared imaging, acoustical imaging, tactile feel, inertial position measuring, optical or acoustic ranging or force or torque measuring capabilities. | ||
| IL1399 | Software for automatically controlled industrial systems to produce assemblies or discrete parts (except software in machine executable form for industrial sectors other than nuclear, aerospace, shipbuilding, heavy vehicles, machine building, microelectronics and electronics), possessing all of the following characteristics– … | A |
(1) Specially designed for automatically controlled industrial systems which include at least eight pieces of any combination of items of the following equipment– | ||
(a) a machine tool or dimensional inspection machine specified in the entries in Group 3 relating to machine tools and numerical control systems and machine tools for generating optical quality surfaces, | ||
(b) a robot specified in the entry in Group 3D relating thereto; | ||
(c) a digitally-controlled spin-forming or flow-forming machine specified in the entry in Group 3A relating thereto; | ||
(d) digitally-controlled equipment specified in the entries in Group 3A relating to equipment, tools, dies, moulds, fixtures and gauges for the manufacture or inspection of aircraft, aircraft manufactures, aircraft engines, gas turbine blades or vanes and gear making machines; | ||
(e) a digitally-controlled electric arc device specified in the entry in Group 3C relating to plasma arc equipment; | ||
(f) digitally-controlled equipment specified in the entries in Group 3D relating to equipment for the manufacture or testing of printed circuit boards, electronic components and materials; | ||
(g) digitally-controlled equipment specified in the entry in Group 3D relating to equipment for the production of fibrous and filamentary materials; | ||
(h) digitally-controlled equipment specified in the entry in Group 3F relating to electronic measuring, calibrating, counting and testing equipment; | ||
(i) a digitally-controlled measuring system as specified in the entry in Group 3F relating to precision linear and angular measuring systems; | ||
(2) Capable of integrating in a hierarchical manner, while having access to data which may be stored outside the supervisory digital computer, the manufacturing process with (i) design functions or (ii) planning and scheduling functions; and | ||
(3) Automatically generating or verifying the manufacturing data and instructions, including selection of equipment and sequences of manufacturing operations for the manufacturing processes from design and manufacturing data, or automatically reconfiguring the automatically controlled industrial system through reselecting equipment and sequences of manufacturing operation by real-time processing of data pertaining to anticipated but unscheduled events (except software which only provides rescheduling of functionally identical equipment within flexible manufacturing units using prestored part programmes and a prestored strategy for the distribution of the part programmes). | ||
| In this entry– | ||
| “automatically controlled industrial system” is a combination of one or more flexible manufacturing units and a supervisory digital computer for coordination of the independent sequences of computer instructions to, from and within the flexible manufacturing units; | ||
| “flexible manufacturing unit” is an entity which consists of a combination of a digital computer including its own main storage and its own related equipment and at least one of the machines specified in head (1) above of this entry. | ||
| (See also the entry in Group 4 relating to technology for the design of automatically controlled industrial systems.) |