Paragraph 2E Technology
Technology required for the development of goods specified in sub-categories 2A, 2B or 2D.
Technology required for the production of goods specified in sub-categories 2A or 2B.
Other technology, as follows:
Technology:
For the development of interactive graphics as an integrated part in numerical control units for preparation or modification of part programmes;
For the development of generators of machine tool instructions (e.g., part programmes) from design data residing inside numerical control units;
For the development of integration software for incorporation of expert systems for advanced decision support of shop floor operations into numerical control units;
Technology for metal-working manufacturing processes, as follows:
Technology for the design of tools, dies or fixtures specially designed for the following processes:
Superplastic forming;
Diffusion bonding;
Direct-acting hydraulic pressing;
Technical data consisting of process methods or parameters as listed below used to control:
Superplastic forming of aluminium alloys, titanium alloys or superalloys:
Surface preparation;
Strain rate;
Temperature;
Pressure;
Diffusion bonding of superalloys or titanium alloys:
Surface preparation;
Temperature;
Pressure;
Direct-acting hydraulic pressing of aluminium alloys or titanium alloys:
Pressure;
Cycle time;
Hot isostatic densification of titanium alloys, aluminium alloys or superalloys:
Temperature;
Pressure;
Cycle time;
Technology for the development or production of hydraulic stretch-forming machines and dies therefor, for the manufacture of airframe structures;
Technology for:
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The application of inorganic overlay coatings or inorganic surface modification coatings, specified in column 3 of the following Table;
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To non-elecronic substrates, specified in column 2 of the following Table; By processes specified in column 1 of the following Table and defined in the Note.
TABLE—
DEPOSITION TECHNIQUES
1 Coating Process (1)f1
2 Substrate
3 Resultant Coating
(The numbers in parenthesis refer to the Notes following this Table.)
A.Chemical Vapour Deposition (CVD)
Superalloys Aluminides for internal passages Ceramics and low-expansion glasses(14) Silicides Carbides Dielectric layers (15) Carbon-carbon, ceramic and metal matrix composites Silicides Carbides Refractory metals Mixtures thereof (4) Dielectric layers (15) Aluminides Alloyed aluminides (2) Cemented tungsten carbide (16), silicon carbide Carbides Tungsten Mixtures thereof (4) Dielectric layers (15) Molybdenum and molybdenum alloys Dielectric layers (15) Beryllium and beryllium alloys Dielectric layers (15) Sensor window materials (9) Dielectric layers (15) B.Thermal-Evaporation Physical Vapour Deposition (TE-PVD)
1.Physical Vapour Deposition (PVD): Electron-Beam (EB-PVD)
Superalloys Alloyed silicides Alloyed aluminides (2) MCrA1X (5) Modified zirconia (12) Silicides Aluminides Mixtures thereof (4) Ceramics and low-expansion glasses (14) Dielectric layers (15) Corrosion resistant steel (7) MCrA1X (5) Modified zirconia (12) Mixtures thereof (4) Carbon-carbon, ceramic and metal matrix composites Silicides Carbides Refractory metals Mixtures thereof (4) Dielectric layers (15) Cemented tungsten carbide (16), silicon carbide Carbides Tungsten Mixtures thereof (4) Dielectric layers (15) Molybdenum and molybdenum alloys Dielectric layers (15) Beryllium and beryllium alloys Dielectric layers (15) Borides Sensor window materials (9) Dielectric layers (15) Titanium alloys (13) Borides Nitrides B.2.Ion assisted resistive heating Physical Vapour Deposition (Ion Plating)
Ceramics and low-expansion glasses (14) Dielectric layers (15) Carbon-carbon, ceramic and metal matrix composites Dielectric layers (15) Cemented tungsten carbide (16), silicon carbide Dielectric layers (15) Molybdenum and molybdenum alloys Dielectric layers (15) Beryllium and beryllium alloys Dielectric layers (15) Sensor window materials (9) Dielectric layers (15) B.3.Physical Vapour Deposition: laser evaporation
Ceramics and low-expansion glasses (14) Silicides Dielectric layers (15) Carbon-carbon, ceramic and metal matrix composites Dielectric layers (15) Cemented tungsten carbide (16), silicon carbide Dielectric layers (15) Molybdenum and molybdenum alloys Dielectric layers (15) Beryllium and beryllium alloys Dielectric layers (15) Sensor window materials (9) Dielectric layers (15) Diamond-like carbon B.4.Physical Vapour Deposition: cathodic arc discharge
Superalloys Alloyed silicides Alloyed aluminides (2) MCrA1X (5) Polymers (11) and organic matrix composites Borides Carbides Nitrides C.Pack cementation (see A above for out-of-pack cementation) (10)
Carbon-carbon, ceramic and metal matrix composites Silicides Carbides Mixtures thereof (4) Titanium alloys (13) Silicides Aluminides Alloyed aluminides (2) Refractory metals and alloys (8) Silicides Oxides D. Plasma spraying Superalloys MCrA1X (5) Modified zirconia (12) Mixtures thereof (4) Abradable Nickel-Graphite Abradable Ni-Cr-Al-Bentonite Abradable Al-Si-Polyester Alloyed aluminides (2) Aluminium alloys (6) MCrA1X (5) Modified zirconia (12) Silicides Mixtures thereof (4) Refractory metals and alloys (8) Aluminides Silicides Carbides Corrosion resistant steel (7) Modified zirconia (12) Mixtures thereof (4) Titanium alloys (13) Carbides Aluminides Silicides Alloyed aluminides (2) Abradable Nickel-Graphite Abradable Ni-Cr-Al-Bentonite Abradable Al-Si-Polyester E. Slurry Deposition Refractory metals and alloys (8) Fused silicides Fused aluminides except for resistance heating elements Carbon-carbon, ceramic and metal matrix composites Silicides Carbides Mixtures thereof (4) F. Sputter Deposition Superalloys Alloyed silicides Alloyed aluminides (2) Noble metal modified aluminides (3) MCrA1X (5) Modified zirconia (12) Platinum Mixtures thereof (4) Ceramics and low-expansion glasses (14) Silicides Platinum Mixtures thereof (4) Dielectric layers (15) Titanium alloys (13) Borides Nitrides Oxides Silicides Aluminides Alloyed aluminides (2) Carbides Carbon-carbon, ceramic and metal matrix composites Silicides Carbides Refractory metals Mixtures thereof (4) Dielectric layers (15) Cemented tungsten carbide (16), silicon carbide Carbides Tungsten Mixtures thereof (4) Dielectric layers (15) Molybdenum and molybdenum alloys Dielectric layers (15) Beryllium and beryllium alloys Borides Sensor window materials (9) Dielectric layers (15) Dielectric layers (15) Refractory metals and alloys (8) Aluminides Silicides Oxides Carbides G. Ion Implantation High temperature bearing steels Additions of chromium, tantalum or niobium (columbium) Titanium alloys (13) Borides Nitrides Beryllium and beryllium alloys Borides Cemented tungsten carbide(16) Carbides Nitrides
Annotations
Footnotes
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(The numbers in parenthesis refer to the Notes following this Table.)