Division 4.2.5.2 Procedure

The components shall be tested using leak test gas at the following conditions:

1. (a)

   At ambient temperature and at 0,02 times nominal working pressure;

2. (b)

   At ambient temperature and at nominal working pressure;

3. (c)

   At the minimum required material temperature, in accordance with section 2.7.5.1., after sufficient conditioning time at this temperature to ensure thermal stability and at 0,02 times nominal working pressure and at nominal working pressure;

4. (d)

   At the maximum required material temperature, in accordance with section 2.7.5.1., after sufficient conditioning time at this temperature to ensure thermal stability and at 0,02 times nominal working pressure and 1,25 times nominal working pressure, except for components with a required material temperature of 120 °C where the higher test pressure shall be 1,37 times nominal working pressure.

For heat exchangers this test shall only be undertaken on the hydrogen circuit.