OpenLegislation

Division 2E Technology

United Kingdom

Original text. Later amendments are not shown.

2E001
  • "Technology" according to the General Technology Note for the "development" of equipment or "software" specified in 2A, 2B or 2D.

    Note: 2E001 includes "technology" for the integration of probe systems into coordinate measurement machines specified in 2B006.a.

  • 2E002
  • "Technology" according to the General Technology Note for the "production" of equipment specified in 2A or 2B.

  • 2E003
  • Other "technology", as follows:

    1. a..

      Not used;

    2. b..

      "Technology" for metal-working manufacturing processes, as follows:

      1. 1..

        "Technology" for the design of tools, dies or fixtures specially designed for any of the following processes:

        1. a..

          "Superplastic forming";

        2. b..

          "Diffusion bonding"; or

        3. c..

          ‘Direct-acting hydraulic pressing’;

      2. 2..

        Technical data consisting of process methods or parameters as listed below used to control:

        1. a..

          "Superplastic forming" of aluminium alloys, titanium alloys or "superalloys":

          1. 1..

            Surface preparation;

          2. 2..

            Strain rate;

          3. 3..

            Temperature;

          4. 4..

            Pressure;

        2. b..

          "Diffusion bonding" of "superalloys" or titanium alloys:

          1. 1..

            Surface preparation;

          2. 2..

            Temperature;

          3. 3..

            Pressure;

        3. c..

          'Direct-acting hydraulic pressing'of aluminium alloys or titanium alloys:

          1. 1..

            Pressure;

          2. 2..

            Cycle time;

        4. d..

          ‘Hot isostatic densification’ of titanium alloys, aluminium alloys or "superalloys":

          1. 1..

            Temperature;

          2. 2..

            Pressure;

          3. 3..

            Cycle time;

        2E003 b. 2. Technical Notes:

        1.

        ‘Direct-acting hydraulic pressing’ is a deformation process which uses a fluid-filled flexible bladder in direct contact with the workpiece.

        2.

        ‘Hot isostatic densification’ is a process of pressurising a casting at temperatures exceeding 375 K (102 °C) in a closed cavity through various media (gas, liquid, solid particles, etc.) to create equal force in all directions to reduce or eliminate internal voids in the casting

    3. c..

      "Technology" for the "development" or "production" of hydraulic stretch-forming machines and dies therefor, for the manufacture of airframe structures;

    4. d..

      Not used;

    5. e..

      "Technology" for the "development" of integration "software" for incorporation of expert systems for advanced decision support of shop floor operations into "numerical control" units;

    6. f..

      "Technology" for the application of inorganic overlay coatings or inorganic surface modification coatings (specified in column 3 of the following table) to non-electronic substrates (specified in column 2 of the following table), by processes specified in column 1 of the following table and defined in the Technical Note.

      Note: The table and Technical Note appear after entry 2E301.

      N.B. This table should be read to specify the "technology" for a particular Coating Process only when the Resultant Coating in column 3 is in a paragraph directly across from the relevant Substrate under column 2. For example, Chemical Vapour Deposition (CVD) coating process technical data are included for the application of silicides to carbon-carbon, ceramic and metal "matrix""composites" substrates, but are not included for the application of silicides to ‘cemented tungsten carbide’ (16), ‘silicon carbide’ (18) substrates. In the second case, the resultant coating is not listed in the paragraph under column 3 directly across from the paragraph under column 2 listing ‘cemented tungsten carbide’ (16), ‘silicon carbide’ (18).

  • 2E101
  • "Technology" according to the General Technology Note for the "use" of equipment or "software" specified in 2B004, 2B009, 2B104, 2B109, 2B116, 2B119 to 2B122 or 2D101.

  • 2E201
  • "Technology" according to the General Technology Note for the "use" of equipment or "software" specified in 2A225, 2A226, 2B001, 2B006, 2B007.b., 2B007.c., 2B008, 2B009, 2B201, 2B204, 2B206, 2B207, 2B209, 2B225 to 2B233, 2D201 or 2D202.

  • 2E301
  • "Technology" according to the General Technology Note for the "use" of goods specified in 2B350 to 2B352.

  • Table

    Deposition techniques

    The numbers in parenthesis refer to the Notes following this Table.

    1. Coating Process (1)f1 2. Substrate3. Resultant Coating

    A.

    Chemical Vapour Deposition (CVD)

    "Superalloys"Aluminides for internal passages
    Ceramics (19) and Low expansion glasses (14)

    Silicides

    Carbides

    Dielectric layers (15)

    Diamond

    Diamond-like carbon (17)

    Carbon-carbon, Ceramic and Metal "matrix""composites"

    Silicides

    Carbides

    Refractory metals

    Mixtures thereof (4)

    Dielectric layers (15)

    Aluminides

    Alloyed aluminides (2)

    Boron nitride

    Cemented tungsten carbide (16), Silicon carbide (18)

    Carbides

    Tungsten

    Mixtures thereof (4)

    Dielectric layers (15)

    Molybdenum and Molybdenum alloysDielectric layers (15)
    Beryllium and Beryllium alloys

    Dielectric layers (15)

    Diamond

    Diamond-like carbon (17)

    Sensor window materials (9)

    Dielectric layers (15)

    Diamond

    Diamond-like carbon (17)

    B.

    Thermal-Evaporation Physical Vapour Deposition (TE-PVD)

    B.1.

    Physical Vapour Deposition (PVD): Electron-Beam (EB-PVD)

    "Superalloys"

    Alloyed silicides

    Alloyed aluminides (2)

    MCrAlX (5)

    Modified zirconia (12)

    Silicides

    Aluminides

    Mixtures thereof (4)

    Ceramics (19) and Low expansion glasses (14)Dielectric layers (15)
    Corrosion resistant steel (7)

    MCrAlX (5)

    Modified zirconia (12)

    Mixtures thereof (4)

    Carbon-carbon, Ceramic and Metal "matrix""composites"

    Silicides

    Carbides

    Refractory metals

    Mixtures thereof (4)

    Dielectric layers (15)

    Boron nitride

    Cemented tungsten carbide (16), Silicon carbide (18)

    Carbides

    Tungsten

    Mixtures thereof (4)

    Dielectric layers (15)

    Molybdenum and Molybdenum alloysDielectric layers (15)
    Beryllium and Beryllium alloys

    Dielectric layers (15)

    Borides

    Beryllium

    Sensor window materials (9)Dielectric layers (15)
    Titanium alloys (13)

    Borides

    Nitrides

    B.2.

    Ion assisted resistive heating Physical Vapour Deposition (PVD) (Ion Plating)

    Ceramics (19) and Low-expansion glasses

    Dielectric layers (15)

    Diamond-like carbon (17)

    Carbon-carbon, Ceramic and Metal "matrix""composites"Dielectric layers (15)
    Cemented tungsten carbide (16), Silicon carbideDielectric layers (15)
    Molybdenum and Molybdenum alloysDielectric layers (15)
    Beryllium and Beryllium alloysDielectric layers (15)
    Sensor window materials (9)

    Dielectric layers (15)

    Diamond-like carbon (17)

    B.3.

    Physical Vapour Deposition (PVD): "Laser" Vaporization

    Ceramics (19) and Low expansion glasses (14)

    Silicides

    Dielectric layers (15)

    Diamond-like carbon (17)

    Carbon-carbon, Ceramic and Metal "matrix""composites"Dielectric layers (15)
    Cemented tungsten carbide (16), Silicon carbideDielectric layers (15)
    Molybdenum and Molybdenum alloysDielectric layers (15)
    Beryllium and Beryllium alloysDielectric layers (15)
    Sensor window materials (9)

    Dielectric layers (15)

    Diamond-like carbon (17)

    B.4.

    Physical Vapour Deposition (PVD): Cathodic Arc Discharge

    "Superalloys"

    Alloyed silicides

    Alloyed aluminides (2)

    MCrAlX (5)

    Polymers (11) and Organic "matrix""composites"

    Borides

    Carbides

    Nitrides

    Diamond-like carbon (17)

    C.

    Pack cementation (see A above for out-of-pack cementation) (10)

    Carbon-carbon, Ceramic and Metal "matrix""composites"

    Silicides

    Carbides

    Mixtures thereof (4)

    Titanium alloys (13)

    Silicides

    Aluminides

    Alloyed aluminides (2)

    Refractory metals and alloys (8)

    Silicides

    Oxides

    D.

    Plasma spraying

    "Superalloys"

    MCrAlX (5)

    Modified zirconia (12)

    Mixtures thereof (4)

    Abradable Nickel-Graphite

    Abradable materials containing Ni-Cr-Al

    Abradable Al-Si-Polyester

    Alloyed aluminides (2)

    Aluminium alloys (6)

    MCrAlX (5)

    Modified zirconia (12)

    Silicides

    Mixtures thereof (4)

    Refractory metals and alloys (8)

    Aluminides

    Silicides

    Carbides

    Corrosion resistant steel (7)

    MCrAlX (5)

    Modified zirconia (12)

    Mixtures thereof (4)

    Titanium alloys (13)

    Carbides

    Aluminides

    Silicides

    Alloyed aluminides (2)

    Abradable Nickel-Graphite

    Abradable materials containing Ni-Cr-Al

    Abradable Al-Si-Polyester

    E.

    Slurry Deposition

    Refractory metals and alloys (8)

    Fused silicides

    Fused aluminides except for resistance heating elements

    Carbon-carbon, Ceramic and Metal "matrix""composites"

    Silicides

    Carbides

    Mixtures thereof (4)

    F.

    Sputter Deposition

    "Superalloys"

    Alloyed silicides

    Alloyed aluminides (2)

    Noble metal modified aluminides (3)

    MCrAlX (5)

    Modified zirconia (12)

    Platinum

    Mixtures thereof (4)

    Ceramics and Low- expansion glasses (14)

    Silicides

    Platinum

    Mixtures thereof (4)

    Dielectic layers (15)

    Diamond-like carbon (17)

    Titanium alloys (13)

    Borides

    Nitrides

    Oxides

    Silicides

    Aluminides

    Alloyed aluminides (2)

    Carbides

    Carbon-carbon, Ceramic and Metal "matrix""composites"

    Silicides

    Carbides

    Refractory metals

    Mixtures thereof (4)

    Dielectric layers (15)

    Boron nitride

    Cemented tungsten carbide (16), Silicon carbide (18)

    Carbides

    Tungsten

    Mixtures thereof (4)

    Dielectric layers (15)

    Boron nitride

    Molybdenum and Molybdenum alloysDielectric layers (15)
    Beryllium and Beryllium alloys

    Borides

    Dielectric layers (15)

    Beryllium

    Sensor window materials (9)

    Dielectric layers (15)

    Diamond-like carbon (17)

    Refractory metals and alloys (8)

    Aluminides

    Silicides

    Oxides

    Carbides

    G.

    Ion Implantation

    High temperature bearing steelsAdditions of Chromium Tantalum or Niobium (Columbium)
    Titanium alloys (13)

    Borides

    Nitrides

    Beryllium and Beryllium alloysBorides
    Cemented tungsten carbide (16)

    Carbides

    Nitrides

    1. TABLE - DEPOSITION TECHNIQUES - NOTES
    2. TABLE - DEPOSITION TECHNIQUES - TECHNICAL NOTE

    Annotations

    Footnotes

    f1

    The numbers in parenthesis refer to the Notes following this Table.