Division [2B005] Equipment specially designed for the deposition, processing and in-process control of inorganic overlays, coatings and surface modifications, as follows, for substrates specified in column 2, by processes shown in column 1 in the Table following 2E003.f., and specially designed automated handling, positioning, manipulation and control components therefor:F1

1. a..

   Chemical vapour deposition (CVD) production equipment having all of the following:

   NB:

   SEE ALSO 2B105.

   1. 1..

      A process modified for one of the following:

      1. a..

         Pulsating CVD;

      2. b..

         Controlled nucleation thermal deposition (CNTD); or

      3. c..

         Plasma enhanced or plasma assisted CVD; and

   2. 2..

      Having any of the following:

      1. a..

         Incorporating high vacuum (equal to or less than 0,01 Pa) rotating seals; or

      2. b..

         Incorporating in situ coating thickness control;

2. b..

   Ion implantation production equipment having beam currents of 5 mA or more;

3. c..

   Electron beam physical vapour deposition (EB-PVD) production equipment incorporating power systems rated for over 80 kW and having any of the following:

   1. 1..

      A liquid pool level "laser" control system which regulates precisely the ingots feed rate; or

   2. 2..

      A computer controlled rate monitor operating on the principle of photo-luminescence of the ionised atoms in the evaporant stream to control the deposition rate of a coating containing two or more elements;

4. d..

   Plasma spraying production equipment having any of the following:

   1. 1..

      Operating at reduced pressure controlled atmosphere (equal to or less than 10 kPa measured above and within 300 mm of the gun nozzle exit) in a vacuum chamber capable of evacuation down to 0,01 Pa prior to the spraying process; or

   2. 2..

      Incorporating in situ coating thickness control;

5. e..

   Sputter deposition production equipment capable of current densities of 0,1 mA/mm² or higher at a deposition rate of 15 μm/h or more;

6. f..

   Cathodic arc deposition production equipment incorporating a grid of electromagnets for steering control of the arc spot on the cathode;

7. g..

   Ion plating production equipment capable of the in situ measurement of any of the following:

   1. 1..

      Coating thickness on the substrate and rate control; or

   2. 2..

      Optical characteristics.

Note:

2B005 does not control chemical vapour deposition, cathodic arc, sputter deposition, ion plating or ion implantation equipment, specially designed for cutting or machining tools.